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ISSN 1006-852X
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Latest Accepted Articles
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Current Issue
Volume 1, 2024
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Analysis of the influence of container structure on the flow characteristics of vertical vibration polishing granular media
FENG Lidong
,
LI Wenhui
,
LI Xiuhong
,
ZHANG Yan
,
WEN Xuejie
,
FAN Yu
doi:
10.13394/j.cnki.jgszz.2023.0067
10
HTML
5
2
Diamond grown on KTN substrate and its photocatalytic performance
LUAN Yuhan
,
LI Tianwei
,
WANG Xuping
,
HAO Jianxin
,
ZHAO Hongyang
,
FU Qiuming
,
TAO Hong
,
GAO Deng
,
MA Zhibin
doi:
10.13394/j.cnki.jgszz.2023.0007
170
HTML
69
1
Analysis of low-temperature CVD growth process of diamond films in C-H-F atmosphere
JIAN Xiaogang
,
LIANG Xiaowei
,
YAO Wenshan
,
ZHANG Yi
,
ZHANG Binhua
,
CHEN Zhe
,
CHEN Maolin
doi:
10.13394/j.cnki.jgszz.2023.0069
7
HTML
1
1
Preparation of Ti
3
SiC
2
/diamond composites by Ni-Al assisted microwave self-propagating sintering
SHI Shuhao
,
YANG Li
,
GUO Shenghui
,
GAO Jiyun
,
HOU Ming
,
LU Yuanjia
doi:
10.13394/j.cnki.jgszz.2023.0021
5
HTML
2
1
Exploration of ceramic binder diamond aggregated abrasives
CHENG Xiaozhe
,
XU Yan
,
MU Yunchao
,
HAN Jinghe
,
LIU Tao
doi:
10.13394/j.cnki.jgszz.2023.0022
142
HTML
60
1
Preparation of Ni-W alloy disc for dynamic friction polishing of diamond
NIU Hao
,
JIN Zhuji
,
SHEN Yu
,
YANG Huipeng
doi:
10.13394/j.cnki.jgszz.2023.0042
134
HTML
41
1
Development of multilayer brazed diamond grinding wheel for ceramic precision grinding
ZHOU Hao
,
XIAO Bing
,
ZHOU Liyong
,
WANG Su
,
HE Xu
doi:
10.13394/j.cnki.jgszz.2023.0020
88
HTML
15
1
Optimization of dry compression molding process parameters for magnetic abrasive grains based on discrete element method
CUI Zihan
,
GAO Huimin
,
CHEN Yan
,
CHENG Haidong
,
HAN Bing
doi:
10.13394/j.cnki.jgszz.2023.0075
4
HTML
1
1
Calibration of emissivity value of 18CrNiMo7-6 steel and study on cylindrical grinding temperature
WANG Dong
,
ZHAO Rui
,
ZHANG Zhipeng
,
ZHANG Yinxia
,
QIAO Ruiyong
doi:
10.13394/j.cnki.jgszz.2023.0013
103
HTML
31
1
On line prediction of roll grinding chatter based on EMD component and wavelet packet energy entropy
ZHU Huanhuan
,
CHI Yulun
,
ZHANG Mengmeng
,
XIONG Li
,
YING Xiaoang
doi:
10.13394/j.cnki.jgszz.2022.0198
4
HTML
1
1
Study on the machining performance of electric antirust grinding
CAI Zhongwei
,
SUN Yuli
,
CHEN Fayu
,
SHENG Yi
,
ZUO Dunwen
doi:
10.13394/j.cnki.jgszz.2023.0011
124
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35
1
Investigation on mechanism of nano-machining of single-crystal silicon carbide on non-continuous surface with diamond abrasive
WANG Yifan
,
TANG Wenzhi
,
HE Yan
,
GAO Xingjun
,
FAN Lin
,
SONG Shuyuan
doi:
10.13394/j.cnki.jgszz.2023.0057
5
HTML
1
1
Preliminary investigation of dry tribochemical mechanical polishing of single crystal SiC substrates
XUE Mingpu
,
XIAO Wen
,
LI Zongtang
,
WANG Zhankui
,
SU Jianxiu
doi:
10.13394/j.cnki.jgszz.2023.0052
4
HTML
1
1
Effect of abrasive vibration on microstructure evolution and material removal of SiC CMP
TANG Ailing
,
YUAN Zewei
,
TANG Meiling
,
WANG Ying
doi:
10.13394/j.cnki.jgszz.2023.0053
4
HTML
1
1
Analysis and optimization of traveling wave vibration of five kinds of diamond circular saw blades
GAO Xianyi
,
ZHANG Dechen
,
MA Guoqing
,
LIU Xingdong
,
WANG Yubo
doi:
10.13394/j.cnki.jgszz.2023.0008
121
HTML
31
1
Wear experiment on underwater drilling of P110 steel using superhard abrasive core drill
WU Tao
,
HUANG Hui
doi:
10.13394/j.cnki.jgszz.2023.0044
80
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19
1
Latest Accepted Articles
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doi:
10.13394/j.cnki.jgszz.2023.0272
37
Preparation and propertiesof intermetallic-bonded diamond grindingwheel for thinning silicon carbide wafers
doi:
10.13394/j.cnki.jgszz.2023.0250
57
Numerical simulation investigations into the effect of machining parameters on the cutting process for ZrO2 ceramics
doi:
10.13394/j.cnki.jgszz.2023.0188
43
Simulation study of cutting fluid flow field in kerf of fine diameter diamond wire saw
doi:
10.13394/j.cnki.jgszz.2023.0235
178
doi:
10.13394/j.cnki.jgszz.2023.0267
75
doi:
10.13394/j.cnki.jgszz.2023.0164
272
Research Status of Thermal Damage Inhibition Technology for Diamond
doi:
10.13394/j.cnki.jgszz.2023.0166
177
Numerical simulation and experimental study on the uniformity of MPCVD diamond coatings
doi:
10.13394/j.cnki.jgszz.2023.0211
145
Simulation and experimentalanalysis of composite chamfering of superhard cutting toolsbased on edge grinding technology
doi:
10.13394/j.cnki.jgszz.2023.0223
99
Comparative experimental study on machining edge of carbide end milling cutter with different tool passivation methods
doi:
10.13394/j.cnki.jgszz.2023.0058
171
Study on Physicochemical Properties and Removal Mechanism of SiC Ceramics Processed by Femtosecond Laser
doi:
10.13394/j.cnki.jgszz.2023.0088
121
Effect of boron concentration and gas pressure on the electrochemical oxidation performance changes of HFCVD diamond films on Ti substrates
doi:
10.13394/j.cnki.jgszz.2023.0071
131
Simulation and experimental study on micro-cutting silicon carbide crystal with single grain diamond
doi:
10.13394/j.cnki.jgszz.2023.0158
194
doi:
10.13394/j.cnki.jgszz.2023.0046
137
Effect of component design and optimization on the organization and properties of PcBN composites
doi:
10.13394/j.cnki.jgszz.2023.0090
127
Effect of Lapping Pressure on Surface quality of polycrystalline diamond (Shandong Institute of Scientific and Technical Information, Jinan , 250101,China ,SUN Guodong)
doi:
10.13394/j.cnki.jgszz.2023.0036
167
doi:
10.13394/j.cnki.jgszz.2023.0129
96
Functional surfaces of medical devices based on laser processing: a review
doi:
10.13394/j.cnki.jgszz.2023.0010
134
Experimental study on Normal Force of cutting sapphire with multi-line swinging reciprocating saw
doi:
10.13394/j.cnki.jgszz.2023.0039
129
Study of different Pore-marking agent on properties of resin bond diamond wheel of fine grinding cemented carbide ball valve
doi:
10.13394/j.cnki.jgszz.2023.0116
105
Effect of corrosion on sawing stability of diamond circular saw blade
doi:
10.13394/j.cnki.jgszz.2023.0115
115
Prediction of grinding surface roughness of Al2O3-based insulating coating on bearing surface considering the change of grinding wheel surface morphology
doi:
10.13394/j.cnki.jgszz.2023.0118
115
Effect Mechanism of Nano-scratch Speed on Removal Behavior of Single Crystal Silicon
doi:
10.13394/j.cnki.jgszz.2023.0124
81
Energy Consumption Modeling and Parameter Optimization of Tower Combined Diamond Circular Saw Blade
doi:
10.13394/j.cnki.jgszz.2023.0128
114
Research on cutting burrs in high speed milling of aluminum alloy plane with diamond coated tools
doi:
10.13394/j.cnki.jgszz.2023.0130
90
Experimental evaluation of grinding zirconia ceramics with vein bionic fractal textured diamond grinding wheel
doi:
10.13394/j.cnki.jgszz.2023.0131
116
Application of Diamond Based Materials in Efficient Heat Dissipation and Surface Microchannel Fabrication Technology
doi:
10.13394/j.cnki.jgszz.2023.0132
156
Analysis and optimization of traveling wave of large diamond core drill bit
doi:
10.13394/j.cnki.jgszz.2023.0137
123
Preparation of diamond coated floating core and its application in copper pipe production
doi:
10.13394/j.cnki.jgszz.2023.0138
105
The Experimental Study on Structured Topological Fish Scale Surface by Micro-Abrasive Jet Machining
doi:
10.13394/j.cnki.jgszz.2023.0139
115
On-linediscrimination of diamond roller profile state
doi:
10.13394/j.cnki.jgszz.2023.0148
137
(a)10%, (b) 20% , (c) 30% , (d)40%.
doi:
10.13394/j.cnki.jgszz.2023.0170
93
doi:
10.13394/j.cnki.jgszz.2023.0171
122
Study on Mechanical Properties and Rock Breaking Effect of Ridge-Shaped Cutters
doi:
10.13394/j.cnki.jgszz.2023.0172
111
Simulation experimental on material removal mechanism of ITO conductive glass by single abrasive
doi:
10.13394/j.cnki.jgszz.2023.0183
126
Effect of pad and slurry on fixed abrasive polishing of gallium oxide crystal
doi:
10.13394/j.cnki.jgszz.2022-0043
483
Development of CAM system for automatic compound dressing of superabrasive grinding wheels
doi:
10.13394/j.cnki.jgszz.2022-0061
288
Study on the Mechanism and Process Magnetorheological Variable Gap Dynamic Pressure Planarization Finishing
doi:
10.13394/j.cnki.jgszz.2022-0004
384
Effect of Fe
3
O
4
Characteristics on Properties of Solid-phase Fenton Reaction Lapping Pellets for Single-Crystal SiC
doi:
10.13394/j.cnki.jgszz.2022-0008
328
Archive
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News
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The selection of The Most Influential Paper of 2021 has began!
The Diamond & Abrasive Engineering has been indexed by DOAJ
The academic influence of Diamond & Abrasives Engineering just reached a historical record
International Diamond Conference would be held on Nov. 9, 2022 in Zhengzhou, China
Call for applicants to the Young Scientist Awards (2022)
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Simulation method of grinding wheel topography
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Nanoscale removal mechanisms in abrasive machining of brittle solids
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Study on optimal method of induction brazing temperature for single-layer CBN grinding wheel
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Research progress and prospect of high entropy oxide
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Research status and prospect of additive manufacturing diamond tools
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Research on grinding of biological tissue
WU Maozhong
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WANG Chengyong
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Study on properties of low temperature vitrified bond modified by aluminum powder
WANG Yanming
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HOU Yonggai
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XIA Xuefeng
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LI Wenfeng
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HOU Chao
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PENG Jin
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08
Challenges of future high-precision polishing methods for hard-to-process materials by the fusion of environmental control and plasma technology
DOI K. Toshiro
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AIDA Hideo
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REN Yinghui
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Nanoscale removal mechanisms in abrasive machining of brittle solids
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Research progress and prospect of high entropy oxide
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Challenges of future high-precision polishing methods for hard-to-process materials by the fusion of environmental control and plasma technology
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Research status and prospect of additive manufacturing diamond tools
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Study on electrochemical mechanical polishing process of silicon carbide crystal
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JIN Zhuji
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Report on operation of Chinese superhard industry in 2021
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Progress of ultrasonic vibration-assisted machining surface micro-texture and serviceability
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Research report on green and low-carbon development of superhard material industry
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Review on chemical mechanical polishing of silicon wafers
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04
Particle size distribution characteristics of electrostatic minimum quantity lubrication and grinding surface quality evaluation
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Ultrasonic assisted grinding of SiC
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