CN 41-1243/TG ISSN 1006-852X
Volume 40 Issue 4
Aug.  2020
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YAN Zhirui, KU Liming, BAI Dujuan, CHEN Haibin, WANG Yongtao. Manufacturing technique and industry status of semiconductor silicon wafers[J]. Diamond & Abrasives Engineering, 2020, 40(4): 5-11. doi: 10.13394/j.cnki.jgszz.2020.4.0001
Citation: YAN Zhirui, KU Liming, BAI Dujuan, CHEN Haibin, WANG Yongtao. Manufacturing technique and industry status of semiconductor silicon wafers[J]. Diamond & Abrasives Engineering, 2020, 40(4): 5-11. doi: 10.13394/j.cnki.jgszz.2020.4.0001

Manufacturing technique and industry status of semiconductor silicon wafers

doi: 10.13394/j.cnki.jgszz.2020.4.0001
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  • Rev Recd Date: 2020-08-09
  • Based on the introduction of the basic theory and manufacturing technique of semiconductor silicon wafers, this article analyzes the current global industry situation, industrial development trends and characteristics of silicon wafers. It then discusses, based on the actual situation, the opportunities, the challenges and the existing problems to develop silicon industry in China.

     

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