[1] | QIU Xiaolong, SUN Xingwei, LIU Yin, YANG Heran, DONG Zhixu, ZHANG Weifeng. Simulation experimental on material removal mechanism of ITO conductive glass by single abrasive[J]. Diamond & Abrasives Engineering, 2024, 44(3): 354-362. doi: 10.13394/j.cnki.jgszz.2023.0183 |
[2] | WEN Jiazhou, WANG Qingxia, YU Aiwu, WU Chongjun. Removal mechanism of unidirectional Cf/SiC composites based on single diamond grit scratching[J]. Diamond & Abrasives Engineering, 2024, 44(3): 327-334. doi: 10.13394/j.cnki.jgszz.2023.0104 |
[3] | WANG Lei, WU Runze, NIU Lin, AN Zhibo, JIN Zhuji. Study on electrochemical mechanical polishing process of silicon carbide crystal[J]. Diamond & Abrasives Engineering, 2022, 42(4): 504-510. doi: 10.13394/j.cnki.jgszz.2022.0029 |
[4] | CHEN Guomei, DU Chunkuan, NI Zifeng, BIAN Da, WANG Hao, ZHANG Ping, ZHANG Xin. Effect of complexing agent on chemical-mechanical polishing effect of 316L stainless steel[J]. Diamond & Abrasives Engineering, 2022, 42(6): 753-759. doi: 10.13394/j.cnki.jgszz.2022.0047 |
[5] | XU Hao, SONG Enmin, BIAN Da, ZHAO Yongwu. Investigation of weak corrosion inhibitor for copper chemical mechanical polishing[J]. Diamond & Abrasives Engineering, 2021, 41(5): 32-39. doi: 10.13394/j.cnki.jgszz.2021.5.0006 |
[6] | WANG Hao, CHEN Guomei, NI Zifeng, QIAN Shanhua, BIAN Da, ZHAO Yongwu. Effect of 1, 2, 4 -triazole and benzotriazole on chemical-mechanical polishing of 316L stainless steel[J]. Diamond & Abrasives Engineering, 2021, 41(1): 83-88. doi: 10.13394/j.cnki.jgszz.2021.1.0014 |
[7] | LIU Haixu, WU Qingdong, CAO Xiaojun, QI Wanting, SU Jianxiu. Prediction and optimization of process parameters in chemical mechanical polishing for 304 stainless steel based on response surface methodology[J]. Diamond & Abrasives Engineering, 2021, 41(2): 89-95. doi: 10.13394/j.cnki.jgszz.2021.2.0015 |
[8] | ZHU Yuguang, WANG Yongguang, NIU Shiwei, XIE Yujun, LEI Xiangyu. Effect of environmental friendly complexing agent and oxidant on CMP of aluminium alloy under low pressure[J]. Diamond & Abrasives Engineering, 2020, 40(1): 74-78. doi: 10.13394/j.cnki.jgszz.2020.1.0012 |
[9] | XU Jiahui, KANG Renke, DONG Zhigang, WANG Ziguang. Review on chemical mechanical polishing of silicon wafers[J]. Diamond & Abrasives Engineering, 2020, 40(4): 24-33. doi: 10.13394/j.cnki.jgszz.2020.4.0004 |
[10] | DENG Jiayun, PAN Jisheng, ZHANG Qixiang, GUO Xiaohui, YAN Qiusheng. Research progress in chemical mechanical polishing of single crystal SiC substrates[J]. Diamond & Abrasives Engineering, 2020, 40(1): 79-91. doi: 10.13394/j.cnki.jgszz.2020.1.0013 |
[11] | SUN Zhiming, JIN Zhuji, HAN Xiaolong, FAN Kangnan, SI Likun. Process of mechanical polishing yttrium aluminum garnet crystals[J]. Diamond & Abrasives Engineering, 2018, 38(1): 73-77. doi: 10.13394/j.cnki.jgszz.2018.1.0013 |
[12] | WAN Ce, JIN Zhuji, WU Di, LIU Zuotao, SI Likun. Chemical mechanical planarization of copper sheet with high radius-thickness ratio[J]. Diamond & Abrasives Engineering, 2018, 38(3): 81-85. doi: 10.13394/j.cnki.jgszz.2018.3.0016 |
[13] | LIU Zhenhui, CHEN Shaokun, PENG Yanan, LI Jiejing, SU Jianxiu. Compositions of slurry used in chemical-mechanically polishing 304 stainless steel[J]. Diamond & Abrasives Engineering, 2018, 38(2): 78-81,88. doi: 10.13394/j.cnki.jgszz.2018.2.0016 |
[14] | BAI Linshan, WANG Jinpu, CHU Xiangfeng. Mechanism and optimization of chemical-mechanically polishing ceramic glass substrate with CeO_2 slurry[J]. Diamond & Abrasives Engineering, 2017, 37(2): 1-5,10. doi: 10.13394/j.cnki.jgszz.2017.2.0001 |
[15] | YUAN Zewei, DU Haiyang, HE Yan, ZHANG Yue. Preparation of slurry for photocatalytic assisted chemical mechanical polishing CVD diamond[J]. Diamond & Abrasives Engineering, 2016, 36(5): 15-20,31. doi: 10.13394/j.cnki.jgszz.2016.5.0003 |
[16] | QIN Hongquan, WANG Yongsheng, LI Qing, CHEN Jiapeng, LIU Zhenhui, SU Jianxiu. Polishing slurry of chemical mechanical polishing SUS304 ultrathin stainless steel sheet[J]. Diamond & Abrasives Engineering, 2016, 36(6): 25-28,34. doi: 10.13394/j.cnki.jgszz.2016.6.0006 |
[17] | WANG Jinpu, BAI Linshan, CHU Xiangfeng. Investigation on the chemical mechanical polishing of A-plane sapphire[J]. Diamond & Abrasives Engineering, 2016, 36(3): 43-49. doi: 10.13394/j.cnki.jgszz.2016.3.0009 |
[18] | CHEN Jiapeng, CHEN Shaokun, LI Qing, QIN Hongquan, SU Jianxiu. Study on chemical mechanical polishing of 304 stainless steel sheet based on alkaline polishing slurry[J]. Diamond & Abrasives Engineering, 2016, 36(2): 6-9,23. doi: 10.13394/j.cnki.jgszz.2016.2.0002 |
[19] | LI Qing, CHEN Shaokun, PENG Yanan, QIN Hongquan, FU Sufang, SU Jianxiu. Chemical mechanical polishing process parameters of 304 stainless steel[J]. Diamond & Abrasives Engineering, 2016, 36(5): 21-25. doi: 10.13394/j.cnki.jgszz.2016.5.0004 |
[20] | BI Wenbo, GE Peiqi. Orthogonal experiment on coating material of resin bonded abrasive wire saw[J]. Diamond & Abrasives Engineering, 2016, 36(6): 11-14. doi: 10.13394/j.cnki.jgszz.2016.6.0003 |