Experimental study on sintering of diamond particles with multiple cutting edges

In order to improve the sharpness and machining efficiency of diamond tools and prolong the service life, the surface of diamond particles was processed by low-temperature sintering. The multi-edged diamond particles with different sintering processes were observed and quantitatively analyzed by SEM and mass loss rate. The results show that the best sintering process for the multi-blade treatment of diamond particle is as follows: sintering temperature of 750 ℃, 480 min, oxygenation pumped twice during the sintering process, each time 10 kPa, ventilation 2 min with interval of 2 h. Under this condition, multi-edged diamond particles are processed, and the surface of multi-edged diamond particles with moderate size and uniform pit distribution can be obtained. The grinding experiment on silicon carbide wafer shows that the material removal rate of multi-blade diamond particle is about 1.1 times higher than that of conventional diamond particles. The roughness R_a of the wafer after grinding is about 24% of that of conventional diamond particle, which significantly improves the grinding and polishing efficiency and precision of silicon carbide wafer.