Experimental analysis on sawing performance ofsand-suspension-electroplated wire saw

ZHENG Chuxi; MA Xiaobin; XIE Qian; BI Wenbo; GE Peiqi; GONG Yang; LIU Tingquan

doi:10.13394/j.cnki.jgszz.2019.1.0014

Volume 39 Issue 1

Feb. 2019

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Article Navigation > Diamond & Abrasives Engineering > 2019 > 39(1): 76-79

ZHENG Chuxi, MA Xiaobin, XIE Qian, BI Wenbo, GE Peiqi, GONG Yang, LIU Tingquan. Experimental analysis on sawing performance ofsand-suspension-electroplated wire saw[J]. Diamond & Abrasives Engineering, 2019, 39(1): 76-79. doi: 10.13394/j.cnki.jgszz.2019.1.0014

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ZHENG Chuxi, MA Xiaobin, XIE Qian, BI Wenbo, GE Peiqi, GONG Yang, LIU Tingquan. Experimental analysis on sawing performance ofsand-suspension-electroplated wire saw[J]. Diamond & Abrasives Engineering, 2019, 39(1): 76-79. doi: 10.13394/j.cnki.jgszz.2019.1.0014

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Experimental analysis on sawing performance ofsand-suspension-electroplated wire saw

doi: 10.13394/j.cnki.jgszz.2019.1.0014

1. School of Mechanical Engineering, Shandong University, Jinan 250061, China;
2. Key Laboratory of High-Efficiency and Clean Mechanical Manufacture of Ministry of Education, Shandong University, Jinan 250061, China;
3. Shantian Abrasive Materials Co., Ltd., Linyi 276700, Shandong, China

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Rev Recd Date: 2019-01-10

Available Online: 2022-04-06

Abstract

Abstract

Suspended electroplated diamond wire saws with different sanding positions are used to machine single crystal silicon. The sawing performances of different wires are compared by recording machine time and calculating the efficiency. SEM is used to observe the sanding and wear conditions, and the surface roughness is measured by related instruments. Results show that the density of abrasive grain varies greatly as sanding position changes, while that is the highest when sanding position is close to the center of the launder. It is also found that the cutting efficiency is higher if the wire saw has higher abrasive density. The one with abrasive density of 585 per mm could cut 4.949 mm²/min, 138% higher than that of the compared saw which has abrasive density of 446 per mm and efficiency of 2.158 mm²/min. In addition, there is no big difference on surface quality of silicon wafer machined by wire saws with different abrasive density. The main wear or damage patterns of wire saw are abrasive wear, grain shedding and coating wear and damage.
- diamond wire saw,
- sanding position,
- cutting performance,
- wire saw wear and damage

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沈阳化工大学材料科学与工程学院沈阳 110142

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