[1] | CHEN Jiahu, GE Peiqi. Simulation study of cutting fluid flow field in kerf of fine diameter diamond wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(6): 781-788. doi: 10.13394/j.cnki.jgszz.2023.0235 |
[2] | LIU Yisheng, HUANG Hui, WANG Lanqing, LIAO Xinjiang. Experimental study on normal force of cutting sapphire with multi-wire swing reciprocating wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(2): 143-150. doi: 10.13394/j.cnki.jgszz.2023.0039 |
[3] | WANG Chao, GE Peiqi, He Jikai, WANG Xinhui. Influence of crystal anisotropy and process parameters on surface shape deviation of sapphire slicing[J]. Diamond & Abrasives Engineering, 2023, 43(5): 612-620. doi: 10.13394/j.cnki.jgszz.2022.0207 |
[4] | BAN Xinxing, LI Yunhe, HAN Shaoxing, QIU Hui, WANG Xing, CUI Zhongming. Parameters optimization for ferrite slicing based on grey theory[J]. Diamond & Abrasives Engineering, 2022, 42(3): 332-337. doi: 10.13394/j.cnki.jgszz.2021.3001 |
[5] | ZHAO Yukang, BI Wenbo, GE Peiqi. Multi-camera visual inspection of abrasives distribution density on electroplated diamond wire saw surface[J]. Diamond & Abrasives Engineering, 2021, 41(2): 64-68. doi: 10.13394/j.cnki.jgszz.2021.2.0011 |
[6] | CHEN Yongbiao, ZHANG Songhui, ZHANG Xiaohong, YUCHI Guangzhi, DUAN Jia, JIANG Ruyi, ZHOU Yingying. Study on mechanism and process of cutting silicon carbide ceramics with diamond wire saw[J]. Diamond & Abrasives Engineering, 2021, 41(3): 60-67. doi: 10.13394/j.cnki.jgszz.2021.3.0009 |
[7] | GAO Wei, NI Jinhua, LIU Xingpeng, ZHANG Xu, MA Bojiang. Effect of SiC content on cutting ability of resin diamond wire[J]. Diamond & Abrasives Engineering, 2020, 40(5): 69-73. doi: 10.13394/j.cnki.jgszz.2020.05.0012 |
[8] | PANG Jiwei, GAO Yufei, LI Sheng. Surface characteristics and wire wear of electroplated diamond wire saw slicing photovoltaic polycrystalline silicon[J]. Diamond & Abrasives Engineering, 2019, 39(5): 92-96. doi: 10.13394/j.cnki.jgszz.2019.5.0016 |
[9] | ZHANG Xia, CAI Shunyan, LI Hongmei, LIN Mei. Measurement of grinding wheel surface morphology based on two-dimensional displacement sensor[J]. Diamond & Abrasives Engineering, 2019, 39(3): 17-22. doi: 10.13394/j.cnki.jgszz.2019.3.0004 |
[10] | ZHENG Chuxi, MA Xiaobin, XIE Qian, BI Wenbo, GE Peiqi, GONG Yang, LIU Tingquan. Experimental analysis on sawing performance ofsand-suspension-electroplated wire saw[J]. Diamond & Abrasives Engineering, 2019, 39(1): 76-79. doi: 10.13394/j.cnki.jgszz.2019.1.0014 |
[11] | GAO Wei, DONG Funing, LI Teng, MA Bojiang, WANG Dongxue. Analysis on delay phenomenon of resin diamond wire when slicing silicon[J]. Diamond & Abrasives Engineering, 2018, 38(2): 66-70. doi: 10.13394/j.cnki.jgszz.2018.2.0014 |
[12] | ZHANG Liaoyuan, SU Junjin, LIU Xiaodong, GUAN Huiyu, LIU Wei. Study on mechanical properties of diamond wire saw under ultrasonic tension[J]. Diamond & Abrasives Engineering, 2017, 37(4): 38-43. doi: 10.13394/j.cnki.jgszz.2017.4.0008 |
[13] | ZHOU Bo, MAO Jianbo. Quality inspection method for diamond wire saw[J]. Diamond & Abrasives Engineering, 2017, 37(2): 73-77. doi: 10.13394/j.cnki.jgszz.2017.2.0016 |
[14] | XU Liang, LIU Yibo, XU Qiang. Study on key preparation technology of diamond core drill bit for sapphire[J]. Diamond & Abrasives Engineering, 2017, 37(4): 27-30,37. doi: 10.13394/j.cnki.jgszz.2017.4.0006 |
[15] | LIU Wentao, ZHAO Huiying, LI Bin, ZHAO Lingyu, YU Hechun, FANG Hongjun. Prediction of subsurface damage of endless diamond wire sawing YAG crystal[J]. Diamond & Abrasives Engineering, 2017, 37(3): 55-61,68. doi: 10.13394/j.cnki.jgszz.2017.3.0011 |
[16] | LI Hongda, QIN Juncun, XING Xu, MING Zhaokun. Influence of wire speed on diamond wire saw and surface quality of silicon wafer[J]. Diamond & Abrasives Engineering, 2017, 37(5): 41-44,49. doi: 10.13394/j.cnki.jgszz.2017.5.0007 |
[17] | ZHANG Liaoyuan, ZHAO Yan, MA Kangle, SHANG Mingwei. Contrastive study on diamond wire saw cutting with/without ultrasonic vibration[J]. Diamond & Abrasives Engineering, 2016, 36(2): 32-36. doi: 10.13394/j.cnki.jgszz.2016.2.0008 |
[18] | ZHANG Ziyu, XIAO Bing, WANG Bo, WANG Pengfei. Tensile performance and fracture analysis of brazed diamond wire saw[J]. Diamond & Abrasives Engineering, 2016, 36(5): 55-59. doi: 10.13394/j.cnki.jgszz.2016.5.0011 |
[19] | CAO Youwei, QIAO Guochao. Simulation method of grinding wheel topography[J]. Diamond & Abrasives Engineering, 2016, 36(3): 33-37. doi: 10.13394/j.cnki.jgszz.2016.3.0007 |
[20] | GAO Wei, CENG Jun, LI Hongyu, WANG Dongxue. Effect of power output on morphology of electroplating diamond wire[J]. Diamond & Abrasives Engineering, 2016, 36(4): 54-57. doi: 10.13394/j.cnki.jgszz.2016.4.0011 |