CN 41-1243/TG ISSN 1006-852X
Volume 37 Issue 1
Feb.  2017
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SHI Linfeng, HAN Xue, GAO Yongjuan, LI Kehua, SU Hongliang, ZHAO Xiuxiang, LIU Quanwei. Effect of different disc materials on sapphire wafer lapping process[J]. Diamond & Abrasives Engineering, 2017, 37(1): 78-80. doi: 10.13394/j.cnki.jgszz.2017.1.0016
Citation: SHI Linfeng, HAN Xue, GAO Yongjuan, LI Kehua, SU Hongliang, ZHAO Xiuxiang, LIU Quanwei. Effect of different disc materials on sapphire wafer lapping process[J]. Diamond & Abrasives Engineering, 2017, 37(1): 78-80. doi: 10.13394/j.cnki.jgszz.2017.1.0016

Effect of different disc materials on sapphire wafer lapping process

doi: 10.13394/j.cnki.jgszz.2017.1.0016
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  • Rev Recd Date: 2016-12-03
  • Available Online: 2022-07-12
  • Influence of disc material and abrasive on lapping effect of sapphire wafer is analyzed based on actual machining.Lapping effect,product yield and lapping efficiency are compared when using cast iron disc(CID),ceramic compound disc(CCD),resin-copper disc(RCD)and polyurethane cloth(PUC)with B4C or diamond slurry.The results show that surface quality of sapphire wafer lapped by PUC is best,Ra0.058μm,and that the lapping efficiency of CCD is highest,0.305μm/min with product yield at 96.08%.In conclusion,PUC and diamond slurry are recommended when requiring higher surface quality,such as Ra ≤ 0.06μm,while CCD with B4C slurry is better if more emphasis is put on cost and efficiency(Ra ≤ 0.08μm).

     

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