Simulation of temperature field when polishing germanium wafer using ice-bonded-abrasive polishing pad

The finite element model is established using ABAQUS to simulate the value of temperature fields for ice-bonded-abrasive pad polishing germanium wafer.Temperature contour map and melting thickness value of the pad are obtained and the results of FEM are verified by experiments.FEM results show that the main reason of ice melting is not frictional heat but air convection surrounding the tool.The pad temperature increases fast at the beginning and then slows down.The temperature in the middle of the pad is higher than those in the inner ring and outer ring and the outer ring temperature is higher than that in the inner ring.The thermic effect of friction is more and more obvious as time goes by.The ice-bonded-abrasive polishing pad has excellent self-sharpening performance and service life when polishing time is longer than 1366 s,ambient temperature higher than 0℃,cylinder pressure 20 N,and rotating speed 200 r/min.