CN 41-1243/TG ISSN 1006-852X
Volume 36 Issue 3
Jun.  2016
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ZHENG Lu, GE Peiqi, BI Wenbo, YUAN Guoqiang. Study on coating layer of resin bonded diamond wire saw[J]. Diamond & Abrasives Engineering, 2016, 36(3): 6-10. doi: 10.13394/j.cnki.jgszz.2016.3.0002
Citation: ZHENG Lu, GE Peiqi, BI Wenbo, YUAN Guoqiang. Study on coating layer of resin bonded diamond wire saw[J]. Diamond & Abrasives Engineering, 2016, 36(3): 6-10. doi: 10.13394/j.cnki.jgszz.2016.3.0002

Study on coating layer of resin bonded diamond wire saw

doi: 10.13394/j.cnki.jgszz.2016.3.0002
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  • Rev Recd Date: 2016-03-15
  • Available Online: 2022-07-27
  • In order to overcome the deficiencies of resin bonded diamond wire saw,such as low abrasive holding strength,poor wear resistance and heat resistance,new experiment is carried out by using different coating layer components through orthogonal experiments.It is also studied that the effect of components on performance of the wire saw by cutting mono-crystalline silicon.Resultsshow that the optimal parameters in the components are mass ratio of epoxy resin and phenolic resin 2.5:1,toughening agent CTBN 13wt%,coupling agent KH-550 1wt%,nano-SiO2 particle 3wt%,and the content of diamond abrasive 500 mg/mL.In this condition,the resin bonded diamond wire saw made in this condition has better comprehensive performance in terms of material removal rate,wear rate,coating layer bonding force and cutting quality of workpiece.

     

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