[1] | CHEN Jiahu, GE Peiqi. Simulation study of cutting fluid flow field in kerf of fine diameter diamond wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(6): 781-788. doi: 10.13394/j.cnki.jgszz.2023.0235 |
[2] | BIE Wenbo, ZHAO Bo, CHEN Fan, WANG Xiaobo, ZHAO Chongyang, NIU Ying. Progress of ultrasonic vibration-assisted machining surface micro-texture and serviceability[J]. Diamond & Abrasives Engineering, 2023, 43(4): 401-416. doi: 10.13394/j.cnki.jgszz.2023.0095 |
[3] | CHEN Yongbiao, ZHANG Songhui, ZHANG Xiaohong, YUCHI Guangzhi, DUAN Jia, JIANG Ruyi, ZHOU Yingying. Study on mechanism and process of cutting silicon carbide ceramics with diamond wire saw[J]. Diamond & Abrasives Engineering, 2021, 41(3): 60-67. doi: 10.13394/j.cnki.jgszz.2021.3.0009 |
[4] | ZHAO Yukang, BI Wenbo, GE Peiqi. Multi-camera visual inspection of abrasives distribution density on electroplated diamond wire saw surface[J]. Diamond & Abrasives Engineering, 2021, 41(2): 64-68. doi: 10.13394/j.cnki.jgszz.2021.2.0011 |
[5] | GE Peiqi, CHEN Zibin, WANG Peizhi. Review of monocrystalline silicon slicing technology[J]. Diamond & Abrasives Engineering, 2020, 40(4): 12-18. doi: 10.13394/j.cnki.jgszz.2020.4.0002 |
[6] | ZHOU Jingwen, QIN Wenjin, MU Yingjuan, REN Peiqiang, LIU Xing, CHEN Yan. Comparative study on machining of CFRP by end mill and abrasive router[J]. Diamond & Abrasives Engineering, 2020, 40(4): 76-80. doi: 10.13394/j.cnki.jgszz.2020.4.0012 |
[7] | ZHENG Chuxi, MA Xiaobin, XIE Qian, BI Wenbo, GE Peiqi, GONG Yang, LIU Tingquan. Experimental analysis on sawing performance ofsand-suspension-electroplated wire saw[J]. Diamond & Abrasives Engineering, 2019, 39(1): 76-79. doi: 10.13394/j.cnki.jgszz.2019.1.0014 |
[8] | LI Quanzhou, WANG Chengyong, ZHANG Yue, CHEN Zhihua, ZHAO Danna, ZHENG Lijuan, CHEN Danying, ZENG Chaofeng. Ultrasonic machining technology in dental materials[J]. Diamond & Abrasives Engineering, 2019, 39(5): 112-122. doi: 10.13394/j.cnki.jgszz.2019.5.0020 |
[9] | FAN Baopeng, CHEN Yan, CHEN Binbin, LIANG Yuhong, SUN Liang. Finite element analysis on heat distribution ratio during grinding CFRP[J]. Diamond & Abrasives Engineering, 2019, 39(1): 66-71. doi: 10.13394/j.cnki.jgszz.2019.1.0012 |
[10] | WAN Hongqiang, HAN Peiying, GE Shuai, LI Fancong, LIU Zhihao. Development of ultrasonic vibration polishing method on workpiece surface[J]. Diamond & Abrasives Engineering, 2018, 38(2): 94-100. doi: 10.13394/j.cnki.jgszz.2018.2.0019 |
[11] | YANG Xiaofan, LI Yousheng, LI Lingxiang, WANG Jue, SHEN Zhihuang. Influence of CVD diamond coating process on performance ofcarbide end mill for cutting CFRP[J]. Diamond & Abrasives Engineering, 2018, 38(2): 37-41. doi: 10.13394/j.cnki.jgszz.2018.2.0008 |
[12] | YAN Xiaotong, ZUO Dunwen, SUN Yuli, LI Rui, XU Yang. Manufacturing process of diamond wire saw by composite-brush-plating method[J]. Diamond & Abrasives Engineering, 2017, 37(1): 13-18,24. doi: 10.13394/j.cnki.jgszz.2017.1.0003 |
[13] | LIU Wentao, ZHAO Huiying, LI Bin, ZHAO Lingyu, YU Hechun, FANG Hongjun. Prediction of subsurface damage of endless diamond wire sawing YAG crystal[J]. Diamond & Abrasives Engineering, 2017, 37(3): 55-61,68. doi: 10.13394/j.cnki.jgszz.2017.3.0011 |
[14] | LI Hongda, QIN Juncun, XING Xu, MING Zhaokun. Influence of wire speed on diamond wire saw and surface quality of silicon wafer[J]. Diamond & Abrasives Engineering, 2017, 37(5): 41-44,49. doi: 10.13394/j.cnki.jgszz.2017.5.0007 |
[15] | ZHOU Bo, MAO Jianbo. Quality inspection method for diamond wire saw[J]. Diamond & Abrasives Engineering, 2017, 37(2): 73-77. doi: 10.13394/j.cnki.jgszz.2017.2.0016 |
[16] | YANG Xiaofan, LI Yousheng, LI Lingxiang, SHEN Zhihuang, LIU Judong. Effect of high temperature performance of carbide on carbon fiber reinforced polymer(CFRP) cutting[J]. Diamond & Abrasives Engineering, 2017, 37(5): 45-49. doi: 10.13394/j.cnki.jgszz.2017.5.0008 |
[17] | NI Yongming, LI Zhen, LI Guohe. Experimental study on surface topography and tensile ultimate load of diamond wire saw during life cycle in machining sapphire[J]. Diamond & Abrasives Engineering, 2017, 37(4): 62-66. doi: 10.13394/j.cnki.jgszz.2017.4.0013 |
[18] | ZHANG Liaoyuan, SU Junjin, LIU Xiaodong, GUAN Huiyu, LIU Wei. Study on mechanical properties of diamond wire saw under ultrasonic tension[J]. Diamond & Abrasives Engineering, 2017, 37(4): 38-43. doi: 10.13394/j.cnki.jgszz.2017.4.0008 |
[19] | GAO Wei, CENG Jun, LI Hongyu, WANG Dongxue. Effect of power output on morphology of electroplating diamond wire[J]. Diamond & Abrasives Engineering, 2016, 36(4): 54-57. doi: 10.13394/j.cnki.jgszz.2016.4.0011 |
[20] | ZHANG Ziyu, XIAO Bing, WANG Bo, WANG Pengfei. Tensile performance and fracture analysis of brazed diamond wire saw[J]. Diamond & Abrasives Engineering, 2016, 36(5): 55-59. doi: 10.13394/j.cnki.jgszz.2016.5.0011 |