金刚石与磨料磨具工程

Stability and process control of single-diamond grinding based on clustering of processing morphology data

XU Xinyu, HE Xiansong, CHEN Zhaojie, ZHANG Jingying, YANG Linfeng, XIE Jin

2025, 45(1): 1-11. doi: 10.13394/j.cnki.jgszz.2024.0013

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Objectives In the precision grinding process of hard mold steel workpieces, the subtle changes in machining depth can significantly cause dynamic changes in the magnitude and the direction of grinding forces, which directly lead to unstable machining conditions and affect machining accuracy and surf...

Effect of TiH₂ addition on grinding performance of Cu₃Sn intermetalliccompound diamond wheels

HE Keqiao, CHEN Shuaipeng, KANG Xiyue, HE Yuehui

2025, 45(1): 12-20. doi: 10.13394/j.cnki.jgszz.2023.0261

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Objectives With the development of the modern manufacturing industry, the requirements for material machining accuracy and surface quality are increases continuously. For the precision grinding of high hardness and high wear-resistant materials, superhard material grinding wheels are required to pos...

Tribological performances of alternating multilayer diamond films on Si₃N₄ ceramic substrates

WANG He, ZHAO Haigen, YAN Guangyu

2025, 45(1): 21-30. doi: 10.13394/j.cnki.jgszz.2023.0269

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Objectives With the development of science and technology, silicon nitride ceramics have excellent physical and chemical properties such as high strength, high hardness, high temperature resistance, corrosion resistance, and wear resistance. They can maintain good mechanical properties and chemical ...

Effect of TiN-Al system binder ratio on structure and properties of PcBN

TANG Lihui, XIAO Changjiang, ZHANG Qunfei, ZHENG Haoyu, LI Zhengxin

2025, 45(1): 31-36. doi: 10.13394/j.cnki.jgszz.2023.0284

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Objectives Al and TiN are commonly used components in PcBN synthesis under high temperature and high pressure. But the existing literature studying the TiN-Al bonding system always focuses on the single property variation, such as relative density, hardness, fracture toughness, impact resistance or ...

Effect of doped elements X (B, Al, Sn, Co) on binding performance of IDB-X/Diamond interface

JIAN Xiaogang, YAO Wenshan, ZHANG Yi, LIANG Xiaowei, HU Jibo, CHEN Zhe, CHEN Maolin

2025, 45(1): 37-45. doi: 10.13394/j.cnki.jgszz.2023.0068

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Objectives At present, resource exploration and mining continue to expand to deep underground. Impregnated diamond bits (IDB) with excellent performance have become the main tool for deep underground drilling. Our research group has found that depositing a layer of CVD diamond coating in situ on the...

Effect of Ti powder particle sizes and raw material ratio on properties of Ti-coated diamond powder

HAN Ming, ZHAO Andong, LI Liang

2025, 45(1): 46-55. doi: 10.13394/j.cnki.jgszz.2023.0252

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Objectives Titanium plating on the surface of diamond powder can improve its wettability to the bonding agent, and the preparation process of the titanium-plated metal layer is of great significance to the industrial application of diamond powder. The effect of particle size and raw material ratio o...

Effect of brazing process on microstructure and properties of brazed diamond interface

CUI Bing, JIANG Xue, DU Quanbin, XU Fan, YAN Peipei, WANG Lei, ZHANG Liyan

2025, 45(1): 56-66. doi: 10.13394/j.cnki.jgszz.2024.0026

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Objectives Diamond tools are widely used in various fields. Copper-based brazing materials are used for brazing diamond tools. In response to the problems of low-temperature phase flow and low bonding strength of copper-based brazing materials at high temperatures, different brazing temperatures and...

Grinding power model for flute grinding of solid tools based on equivalent chip thickness

REN Lei, PAN Jiangtao, XIANG Daohui, MA Junjin, CUI Xiaobin

2025, 45(1): 67-74. doi: 10.13394/j.cnki.jgszz.2024.0003

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Objectives During the flute grinding process of solid tools, the majority of grinding power is converted into grinding heat. Excessive grinding power can cause a rapid temperature rise on the surface of the contact area between the grinding wheel and the tool, which can easily lead to grinding burns...

Influencing factors of power consumption in grinding iron ore with diamond cutter head

DING Caizhi, ZHUANG Shiyong, SONG Leibo, DENG Yong, WANG Huanyu, GU Lu

2025, 45(1): 75-85. doi: 10.13394/j.cnki.jgszz.2024.0031

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Objectives The existing mining equipments, such as coal mining machines, excavators, tunneling machines, and diamond tools, are combined to form a new mining equipment called the“grinding mining machine”, which is used for grinding mining. The main advantage of grinding mining applied in metal mines...

Mechanical lapping and polishing process of polycrystalline diamond wafers

LI Jiao, ZHANG Xiaoqiu, WANG Ziguang, ZHANG Xin, ZHANG Yu

2025, 45(1): 86-92. doi: 10.13394/j.cnki.jgszz.2024.0017

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Objectives Diamond is a critical material potentially or already applied in infrared windows, electronic components and acoustic devices for its excellent optical transmittance, high eletron mobility and high breakdown voltage. Mechanical lapping is one of the mainstream methods for diamond planariz...

Force of dressing grinding wheels by diamond rollers with orderly arrangement grains

ZHANG Rui, ZHOU Shuaikang, ZHAO Huadong, ZHU Zhenwei, HE Honghui, LIU Chang

2025, 45(1): 93-101. doi: 10.13394/j.cnki.jgszz.2024.0004

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Objectives With the increasing improvement of science and technology and industrial levels, the modern manufacturing industry has higher and higher precision requirements for grinding processing, and the grinding quality can be improved by enhancing the ability of diamond dressing rollers. However, ...

Analysis of flow field characteristics of silicon carbide CMP under ultrasonic action

WANG Zexiao, YE Linzheng, ZHU Xijing, LIU Yao, CHUAI Shida, LV Boyang, WANG Dong

2025, 45(1): 102-112. doi: 10.13394/j.cnki.jgszz.2023.0273

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Objectives Silicon carbide faces challenges such as low polishing efficiency and poor surface quality during processing. The ultrasonic-assisted CMP (UCMP) processing technology is used to smooth and non-destructive polishing the SiC surface, and the influence of ultrasonic assistance on the CMP flo...

Study on dispersion of abrasive particles in electro Fenton CMP slurry and design of green polishing fluid in neutral environment

CHENG Feng, WANG Zirui, ZHU Rui, WANG Yongguang, PENG Yang, ZHANG Tianyu, ZHAO Dong, FAN Cheng

2025, 45(1): 113-121. doi: 10.13394/j.cnki.jgszz.2023.0242

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Objectives In the process of GaN ultra-precision polishing, diamond abrasives tend to agglomerate, leading to an increase in the average particle size of abrasives in the polishing slurry, which negatively impacts the surface precision of GaN. The addition of Fe²⁺ in the Fenton reaction exacerbates ...

Parameter calibration of a discrete element simulation model for dry lightweight heterogeneous media

LIANG Zhiqiang, LI Xiuhong, WANG Xingfu, LI Wenhui, YANG Shengqiang, LIANG Zhenhua

2025, 45(1): 122-133. doi: 10.13394/j.cnki.jgszz.2024.0016

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Objectives Dry light-shaped medium is a type of machining medium commonly used in the rolling finishing process. Its shape varies, making it difficult to test and calibrate the contact parameters used in discrete element simulation, which affects the accuracy of the simulation. In this study, walnut...

Optimization of magnetic compound fluid polishing process parameters for PMMA workpieces based on grey relational analysis

WANG Youliang, GAO Xichun, ZHANG Wenjuan

2025, 45(1): 134-142. doi: 10.13394/j.cnki.jgszz.2023.0282

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Objectives MCF polishing technology has become an advanced ultra-precision machining method. To address the issue of different process parameters in achieving optimal surface quality or maximum processing efficiency in MCF polishing technology, it is necessary to accurately control the range of each...

2025 Vol. 45, No. 1

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