Study on machining quality of zirconia ceramic hole grinding based on rotating ultrasound vibration
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摘要: 针对陶瓷材料小孔加工质量较差以及加工成本较高等问题,设计一种基于旋转超声辅助的氧化锆陶瓷小孔磨削加工工艺。首先分析旋转超声加工原理,然后在超声振动条件下利用金刚石刀具对氧化锆陶瓷小孔进行单因素磨削加工试验,并对小孔的内壁进行形貌分析和粗糙度检测,最后研究主轴转速、超声功率以及进给速度对小孔表面粗糙度的影响规律。研究结果表明:与普通磨削方式相比,在旋转超声辅助加工条件下,小孔表面质量和残余应力都得到较大改善,当超声功率达到300 W时,加工后的小孔表面粗糙度下降了52%,加工精度明显提高。Abstract: Aiming at the problems of poor processing quality and high processing cost of small holes in ceramics, a rotary ultrasonic assisted grinding process for small holes in zirconia ceramics was designed.Firstly, the principle of rotary ultrasonic machining was analyzed.Then, under the condition of ultrasonic vibration, the single factor small hole grinding experiment of zirconia ceramics was carried out by using diamond tools.The morphology of the inner wall of the small hole was analyzed and the roughness was measured.Finally, the influence of spindle speed, ultrasonic power and feed speed on the surface roughness of the small hole was studied.The results show that, compared with conventional grinding methods, the surface quality and residual stress of small holes are greatly improved and that the machining accuracy is obviously improved with surface roughness decreased by 52% under the condition of 300 W rotary ultrasonic assisted machining.
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Key words:
- abrasive track /
- surface roughness /
- diamond abrasives
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