Analysis on numerical prediction models of surface topography in rotational grinding
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摘要: 工件旋转磨削广泛用于加工单晶硅、玻璃、陶瓷等硬脆材料,预测其磨削表面纹理特征对研究磨削机理、优化磨削工艺有重要意义。基于对现有工件旋转磨削仿真模型的分析与实验验证,讨论其存在的问题及改进方向:在超细砂轮模型中应修正有效磨粒数;基于现有单磨粒划擦实验的基本结论和超精密磨削的特点,工件材料回弹、磨粒刃尖半径以及磨粒成屑临界切深是需进一步考虑的因素。研究结果有助于提升对磨削机理和工艺的认识,进而提高工件旋转磨削效率。Abstract: Rotational grinding is widely used in grinding hard brittle material such as silicon, glass and ceramics. The prediction of grinding surface topography is important for mechanism research and process optimization. Based on analyses and experiment validations of current models, the problems of these models are analyzed and the promotions put forward:When simulating ultra-precision grinding, it is necessary to modify the amount of effective grains; The recovery of workpiece, the cutting edge radius of grains and the critical cutting depth of chip formation are factors that need further attention. The result could promote acknowledge of grinding mechanism and process, and thus promoting the efficiency of rotational grinding.
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