Evolution behavior of microstructure and properties of Cu-20Sn-15Ti filler metal regulated by Si
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摘要: 为通过成分调控改善Cu-Sn-Ti钎料的显微组织及性能，采用扫描电子显微镜、X射线衍射仪及EDS能谱分析等设备，研究了Si对Cu-20Sn-15Ti钎料显微组织与性能的影响规律。结果表明：Cu-20Sn-15Ti钎料的显微组织为大尺寸多边形状CuSn3Ti5相、共晶组织和α-Cu相。添加少量的Si（质量分数≤2.0%）可细化钎料中多边形状CuSn3Ti5相，并生成小尺寸Si3Ti5相，较多的Si（质量分数≥3.0%）会造成多边形状CuSn3Ti5相分化离散、共晶组织粗化减少，Si3Ti5相含量增加且粗化，当Si含量增至5.0%时，钎料不再生成多边形状CuSn3Ti5相和共晶组织，Ti主要用于生成Ti5Si3相，显微组织主要为Ti5Si3相、α-Cu相、Cu41Sn11相和少量条状CuSn3Ti5相；与Cu、Sn相比，Si与Ti具有更强的化学亲和力，Si优先与Ti反应生成Ti5Si3相；Ti5Si3相的三维组织形貌为棱柱状，且呈团聚附生特征，粗条状Ti5Si3相具有中心或侧面孔洞缺陷，孔洞的形成主要与其生长机制有关；随着Si含量的增加，钎料的剪切强度呈“升高-降低-升高”的趋势，断口形貌由准解理断裂和解理断裂的混合形态向解理断裂转变；CuSn3Ti5相易破碎开裂成为起裂源，不同粗大状态CuSn3Ti5相的存在均在一定程度上恶化钎料剪切强度。
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关键词:
- Cu-Sn-Ti钎料 /
- 金刚石 /
- 显微组织 /
- CuSn3Ti5相
Abstract: To improve the microstructure and properties of Cu-Sn-Ti brazing alloy through component control, the effect of Si on the microstructure and properties of Cu-20Sn-15Ti brazing filler metals was studied using scanning electron microscopy, X-ray diffraction, and EDS energy spectrum analysis. The results show that the microstructure of Cu-20Sn-15Ti brazing filler metal is composed of large-sized polygonal CuSn3Ti5 phase, eutectic structure and α-Cu phase. A small amount of Si (≤ 2.0wt%) refines the polygonal-shaped CuSn3Ti5 phase in the brazing filler metal and generates small-sized Si3Ti5 phase. In contrast, a larger amount of Si (≥ 3.0wt%) differentiates the polygonal-shape CuSn3Ti5 phase, reduces the proportion of eutectic structure, and increases the content and size of the Si3Ti5 phase. When the Si content increases to 5.0wt%, the filler metal no longer generates polygonal-shaped CuSn3Ti5 phase and eutectic structure. Instead, Ti primarily forms Ti5Si3 phase, and the microstructure mainly consists of Ti5Si3 phase, α- Cu phase, Cu41Sn11 phase, and a small amount of strip-shaped CuSn3Ti5 phase. Compared with Cu and Sn, Si has a stronger chemical affinity with Ti and preferentially reacts with Ti to form Ti5Si3 phase. The three-dimensional structure of Ti5Si3 phase is prismatic and exhibits agglomerated growth characteristics. The coarse strip Ti5Si3 phase has central or lateral pore defects, which are mainly related to the growth mechanism. As the Si content increases, the shear strength of the filler metals shows a trend of “increasing-decreasing-increasing”, and the fracture morphology transitions from a mixed morphology of quasi-cleavage fracture and cleavage fracture to cleavage fracture. The CuSn3Ti5 phase is prone to breakage and cracking, becoming the source of cracking. The presence of coarse CuSn3Ti5 phase in different states can deteriorate the shear strength of the brazing filler metals to some extent.-
Key words:
- Cu-Sn-Ti filler metal /
- diamond /
- microstructure /
- CuSn3Ti5 phase
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图 1 电弧熔炼钎料铸锭及取样位置示意图
Figure 1. Schematic diagram of arc melting filler metal ingot and sampling location
图 2 Cu-20Sn-10Ti-xSi钎料的显微组织
Figure 2. Microstructure of Cu-20Sn-10Ti-xSi brazing filler metal
图 3 Cu-20Sn-15Ti-xSi钎料的XRD图谱
Figure 3. XRD spectrum of Cu-20Sn-15Ti xSi brazing filler metal
图 5 4#、6#试样中Ti5Si3相的三维形貌
Figure 5. Three-dimensional morphology of Ti5Si3 in sample 4#and 6#
图 6 Si含量分别为0%、2%、5%时液态钎料凝固过程组织演变示意图
Figure 6. Schematic diagram of microstructure evolution during solidification of liquid filler metal with Si content of 0wt%, 2wt% and 5wt% respectively
图 8 Cu-Sn-Ti-xSi钎料剪切性能
Figure 8. Shear properties of the Cu-20Sn-15Ti-xSi filler metals
图 9 Cu-20Sn-15Ti-xSi钎料断口微观形貌
Figure 9. SEM fracture morphology of Cu-20Sn-15Ti-xSi filler metals
图 10 Cu-20Sn-15Ti-xSi钎料断口微观形貌
Figure 10. SEM fracture morphology of Cu-20Sn-15Ti-xSi filler metals
图 11 Si 0.5%钎料局部断口元素分布能谱图像
Figure 11. Energy spectrum image of element distribution at local fracture of Si 0.5% filler metals
表 1 Cu-20Sn-15Ti-xSi钎料含义成分
Table 1. Composition of Cu-20Sn-15Ti-xSi filler metal
序号 ωCu/% ωSn/% ωTi/% ωSi/% 1# 65.00 20.00 15.00 - 2# 64.51 19.99 15.00 0.50 3# 64.04 19.98 14.98 1.00 4# 63.01 20.00 14.99 2.00 5# 61.98 20.00 15.02 3.00 6# 59.99 20.00 15.01 5.00 
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表 2 图2中各点能谱分析结果（at%）
Table 2. EDS analysis results of each point in Fig.2（at%）
测试点 Cu Sn Ti Si 平衡相 1 13.41 34.43 52.17 - CuSn3Ti5 2 76.71 8.42 14.88 - 共晶组织 3 17.53 32.64 49.83 - CuSn3Ti5 4 96.29 1.06 2.65 - α-Cu（富Ti） 5 2.00 0.73 61.12 36.15 Si3Ti5 6 90.79 6.94 1.34 0.93 α-Cu（富Sn） 7 1.43 0.53 60.84 37.20 Si3Ti5 8 77.69 20.60 0.50 1.20 Cu41Sn11 9 1.87 0.64 60.27 37.23 Si3Ti5
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表 3 合金元素系统参数
Table 3. Parameters of alloy element systems
合金系统 (Z/rk)A/(Z/rk)B 电负性差△x 化学亲和力参数η Cu-Ti 0.176 0.4 0.576 Sn-Ti 0.956 0.3 1.256 Si-Ti 1.656 0.3 1.956
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表 4 图9中各点能谱分析结果（at%）
Table 4. EDS analysis results of each point in Fig.9（at%）
测试点 Cu Sn Ti Si 平衡相 A 13.99 33.25 52.76 - CuSn3Ti5 B 76.98 8.33 14.69 - 共晶组织 C 6.84 1.91 52.58 38.68 Si3Ti5 D 69.46 22.13 6.86 1.55 Cu41Sn11 E 12.51 31.12 50.41 5.96 CuSn3Ti5
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