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用于金刚石摩擦化学抛光的Ni-W合金盘制备

牛昊 金洙吉 沈煜 杨辉鹏

牛昊, 金洙吉, 沈煜, 杨辉鹏. 用于金刚石摩擦化学抛光的Ni-W合金盘制备[J]. 金刚石与磨料磨具工程, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042
引用本文: 牛昊, 金洙吉, 沈煜, 杨辉鹏. 用于金刚石摩擦化学抛光的Ni-W合金盘制备[J]. 金刚石与磨料磨具工程, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042
NIU Hao, JIN Zhuji, SHEN Yu, YANG Huipeng. Preparation of Ni-W alloy disc for dynamic friction polishing of diamond[J]. Diamond & Abrasives Engineering, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042
Citation: NIU Hao, JIN Zhuji, SHEN Yu, YANG Huipeng. Preparation of Ni-W alloy disc for dynamic friction polishing of diamond[J]. Diamond & Abrasives Engineering, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042

用于金刚石摩擦化学抛光的Ni-W合金盘制备

doi: 10.13394/j.cnki.jgszz.2023.0042
详细信息
    通讯作者:

    金洙吉,男,教授、博士生导师、硕士生导师。主要研究方向:精密与超精密加工技术、特种加工及其控制技术、难加工材料高效加工技术。Email: kimsg@dlut.edu.cn

  • 中图分类号: TQ164;TG58;TQ153.2

Preparation of Ni-W alloy disc for dynamic friction polishing of diamond

  • 摘要: 为探究镀液成分、工艺条件等因素对Ni-W合金镀层的影响,制备出低内应力、高硬度的Ni-W合金盘,用于金刚石的摩擦化学抛光。采用单一性实验分别探究络合剂浓度、溶液pH、糖精钠浓度对镀层内应力、钨含量、硬度以及沉积速率的影响,并探究不同添加剂对镀层表面整平的效果。最终选用水杨醛为整平剂,并采用反向脉冲电流降低了镀层表面粗糙度,制备出硬度达HV 713,镀层厚度约为0.66 mm的Ni-W合金盘。使用合金盘对金刚石进行摩擦化学抛光,并探究合适的抛光工艺参数。在合金盘转速为8000 r/min,压力为40 N时,金刚石的抛光效果较好,其材料去除率为5.56 μm/min,磨削比达0.394,金刚石表面粗糙度Sa为3.7 nm。使用传统铸铁盘对金刚石进行摩擦化学抛光,通过对比磨损参数发现,Ni-W合金盘能够达到更好的抛光效果。

     

  • 图  1  摩擦化学抛光金刚石原理图

    Figure  1.  Schematic diagram of dynamic friction polishing diamond

    图  2  镀液pH值的影响

    Figure  2.  Effects of bath pH values

    图  3  络合剂加入量的影响

    Figure  3.  Influences of complexing agent content

    图  4  不同柠檬酸三钠浓度下镀层的显微形貌

    Figure  4.  Micromorphologies of coatings at different concentrations of trisodium citrate

    图  5  糖精钠浓度的影响

    Figure  5.  Effect of saccharin sodium concentration

    图  6  抛光盘表面形貌

    Figure  6.  Surface morphology of polishing disc

    图  7  使用不同添加剂后抛光盘的表面形貌

    Figure  7.  Surface morphologies of polishing discs with different additives

    图  8  添加水杨醛的电镀盘镀层侧面形貌

    Figure  8.  Side morphology of coating with salicylaldehyde added

    图  9  电镀盘抛光压力的影响

    Figure  9.  Influences of polishing pressures on electroplating plate

    图  10  电镀盘抛光转速的影响

    Figure  10.  Influences of polishing speeds of electroplating plate

    图  11  金刚石抛光后的表面形貌

    Figure  11.  Surface morphologies of polished diamond

    图  12  铸铁盘抛光压力的影响

    Figure  12.  Effects of polishing pressures on cast iron disc

    图  13  铸铁盘抛光转速的影响

    Figure  13.  Influences of polishing speeds of cast iron disc

    图  14  金刚石抛光后的表面粗糙度

    Figure  14.  Surface roughness after diamond polishing

    表  1  初始镀液配方

    Table  1.   Initial bath formula

    成分化学名称浓度ρ /(g·L−1
    主盐A二水合硫酸镍40.00
    主盐B六水合钨酸钠40.00
    络合剂柠檬酸三钠80.00
    缓冲剂硼酸35.00
    导电盐溴化钠10.00
    表面活性剂十二烷基硫酸钠0.15
    下载: 导出CSV

    表  2  实验设备

    Table  2.   Experimental equipment

    设备名称用途
    QUANTA 450扫描电子显微镜观察Ni-W合金镀层的微观形貌
    Oxford X-Max型EDS测量镀层的元素组分
    MVS-1000Z维氏硬度计测量镀层的显微硬度
    VHX-600E超景深显微镜观察金刚石表面形貌
    3D表面光学轮廓Zygo9000测量金刚石表面粗糙度
    DV215CD精密天平称量镀件质量
    XP6梅特勒电子天平称量金刚石质量
    下载: 导出CSV

    表  3  金刚石的磨削参数对比

    Table  3.   Comparison of grinding parameters of diamond

    参数铸铁盘电镀盘
    金刚石去除率 Rdia / (μm·min−1)0.455.56
    抛光盘磨损率 Rd / (mm³·min−1)0.450.13
    磨削比 R20.0130.394
    表面粗糙度 Sa / nm22.83.7
    下载: 导出CSV
  • [1] SUZUKI K, IWAI M, UEMATSU T, et al. Material removal mechanism in dynamic friction polishing of diamond [J]. Key Engineering Materials,2003,460:238-239. doi: 10.4028/www.scientific.net/KEM.238-239.235
    [2] PAUL E, EVANS C J, MANGAMELLI A, et al. Chemical aspects of tool wear in single point diamond turning [J]. Precision Engineering,1996,18(1):4-19. doi: 10.1016/0141-6359(95)00019-4
    [3] JONHNSON O. Catalysis and the interstitial-electron model for metals [J]. Journal of Catalysis. 1973, 1(21): 1-54.
    [4] 马兴伟. 高速摩擦抛光金刚石膜用FeAl基合金抛光盘的制备及性能研究 [D]. 大连: 大连理工大学, 2011.

    MA Xingwei. Study on the fabracation and properties of FeAl based alloy polishing plate for dynamic friction polishing of diamond film [D]. Dalian: Dalian University of Technology, 2011.
    [5] 孔军. 高速摩擦抛光金刚石用抛光盘的研制[D]. 大连: 大连理工大学, 2013.

    KONG Jun. Develop of polishing plate used in dynamic friction polishing of diamond. [D]. Dalian: Dalian University of Technology, 2013.
    [6] 林佳志. 摩擦化学抛光单晶金刚石的工艺研究[D]. 大连: 大连理工大学, 2015.

    LIN Jiazhi. Research on dynamic friction polishing technology for single crystal diamond [D]. Dalian: Dalian University of Technology, 2015.
    [7] 史双佶. 金刚石摩擦化学抛光用抛光盘制备及抛光机理研究[D]. 大连: 大连理工大学, 2016.

    SHI Shuangji. Preparation and polishing mechanism research of polishing plate used for dynamic friction polishing diamond [D]. Dalian: Dalian University of Technology, 2016.
    [8] KAMPMANN A, SITTINGER V, RECHID J, et al. Large area electrodeposition of Cu(In, Ga)Se2 [J]. Thin Solid Films,2000,361-362:309-313. doi: 10.1016/S0040-6090(99)00863-9
    [9] HUANG C H, SHE W Y, WU H M. Study of stress reducers in nickel-tungsten electroforming baths [J]. Plating and Surface Finishing,1999,86(12):79-83.
    [10] MIZUSHIMA I, TANG P T, HANSEN H N, et al. Residual stress in Ni-W electrodeposits [J]. Electrochimica Acta,2006,51(27):6128-6134. doi: 10.1016/j.electacta.2005.11.053
    [11] LIU R, WANG H, LI X P, et al. Study of internal stress of amorphous Ni-W alloy films [J]. Materials Science and Technology,2009,25(8):960-968. doi: 10.1179/174328408X311071
    [12] BERKH O, BURSTEIN L, SHACHAM-DIAMAND Y, et al. The chemical and electrochemical activity of citrate on Pt electrodes [J]. Journal of the Electrochemical Society,2011,158(6):F85. doi: 10.1149/1.3560572
    [13] 李延伟, 尚雄, 姚金环, 等. 糖精对柠檬酸盐中性电镀镍影响的研究 [J]. 电镀与精饰,2013,35(9):43-46. doi: 10.3969/j.issn.1001-3849.2013.09.011

    LI Yanwei, SHANG Xiong, YAO Jinhuan, et al. Investigations on influences of saccharin additive on nickel electroplating in neutral citrate electrolyte [J]. Plating & Finishing,2013,35(9):43-46. doi: 10.3969/j.issn.1001-3849.2013.09.011
    [14] 成旦红, 郭鹤桐, 刘淑兰. 金属沉积层的应力起源及影响因素 [J]. 电镀与精饰,1992(6):15-19.

    CHENG Danhong, GUO Hetong, LIU Shulan. Stress origin and influence factors of metal deposits [J]. Plating & Finishing,1992(6):15-19.
    [15] MOCKUTE D, BERNOTIENE G. The interaction of additives with the cathode in a mixture of saccharin, 2-butyne-1, 4-diol and phthalimide during nickel electrodeposition in a Watts-type electrolyte [J]. Surface & Coatings Technology,2000,135(1):42-47. doi: 10.1016/S0257-8972(00)00862-8
    [16] 冯立明, 电镀工艺学 [M]. 北京: 化学工业出版社, 2010.

    FENG Liming, et al. Electroplating technology [M]. Beijing: Chemical Industry Press, 2010.
    [17] 安茂忠. 电镀理论与技术 [M]. 哈尔滨: 哈尔滨工业大学出版社, 2004.

    AN Maozhong. Electroplating theory and technology [M]. Harbin: Harbin Institute of Technology Press, 2004.
    [18] BRENNER A. Electrodeposition of tungsten alloys containing cobalt, nickel, and/or iron [M]// BRENNER A. Electrodeposition of Alloys. New York: Academic Press, 1963: 347-412.
    [19] 李延伟, 黄晓曦, 杨哲龙, 等. 镀镍层内应力及其测量方法 [J]. 电镀与环保,2011,31(1):4-7. doi: 10.3969/j.issn.1000-4742.2011.01.002

    LI Yanei, HUANG Xiaoxi, YANG Zhelong, et al. Internal stress of nickel coating and its measuring methods [J]. Electroplating& Pollution Control,2011,31(1):4-7. doi: 10.3969/j.issn.1000-4742.2011.01.002
    [20] BRATOEVA M, ATANASOV N. Effect of sulfamate-citrate electrolyte pH on the Ni-W alloy electrodeposition [J]. Russian Journal of Electrochemistry,2000,36(1):60-63. doi: 10.1007/BF02757797
    [21] OBRADOVIĆ M D, STEVANOVIĆ R M, DESPIĆ A R. Electrochemical deposition of Ni–W alloys from ammonia–citrate electrolyte [J]. Journal of Electroanalytical Chemistry,2003,552:185-196. doi: 10.1016/S0022-0728(03)00151-7
    [22] LI Y, YAO J, HUANG X. Effect of saccharin on the process and properties of nickel electrodeposition from sulfate electrolyte [J]. International Journal of Metallurgical & Materials Engineering,2016,2:149450140. doi: 10.15344/2455-2372/2016/123
    [23] SHREERAM D D, LI S, BEDEKAR V, et al. Effect of reverse pulse time on electrodeposited Ni-W coatings [J]. Surface & Coatings Technology,2017,325:386-396. doi: 10.1016/j.surfcoat.2017.06.037
    [24] 彭超, 殷志伟, 汪晓, 等. 十二烷基硫酸钠和1,4-丁炔二醇电沉积Ni-W合金的机理 [J]. 粉末冶金材料科学与工程,2011,16(2):167-174. doi: 10.3969/j.issn.1673-0224.2011.02.003

    PENG Chao, YIN Zhiwei, WANG Xiao, et al. Mechanism of sodium lauryl sulfate and 1,4-butynediol in electrodepositing Ni-W alloys [J]. Materials Science and Engineering of Powder MetaIlurgy,2011,16(2):167-174. doi: 10.3969/j.issn.1673-0224.2011.02.003
    [25] KUMAR U P, KENNADY C J. Influence of vanillin on the corrosion behavior of Ni-W alloy electrodeposits and its properties [J]. Journal of Electroanalytical Chemistry,2016,782:67-75. doi: 10.1016/j.jelechem.2016.10.009
    [26] KUMAR U P, KENNADY C J, ZHOU Q. Effect of salicylaldehyde on microstructure and corrosion resistance of electrodeposited nanocrystalline Ni-W alloy coatings [J]. Surface & Coatings Technology,2015,283:148-155. doi: 10.1016/j.surfcoat.2015.10.056
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出版历程
  • 收稿日期:  2023-02-27
  • 修回日期:  2023-04-04
  • 录用日期:  2023-04-13
  • 网络出版日期:  2023-11-06
  • 刊出日期:  2024-02-20

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