热压烧结温度对SiCp/Al复合材料性能的影响

蔡佳宁; 乐晨; 樊子民; 李鑫; 唐明强; 赵放

doi:10.13394/j.cnki.jgszz.2022.0105

热压烧结温度对SiCp/Al复合材料性能的影响

doi: 10.13394/j.cnki.jgszz.2022.0105

蔡佳宁^{1, 2},
乐晨^2, ,,
樊子民^1,,
李鑫^{1, 2},
唐明强²,
赵放²

1.
西安科技大学材料科学与工程学院, 西安 710000
2.
泉州天智合金材料科技有限公司, 福建泉州 362000

详细信息

作者简介:
樊子民，男，1977年生，副教授。主要研究方向：先进陶瓷及复合材料。E-mail：fanzimin@126.com

通讯作者:
乐晨，男，1986年生，中级工程师。主要研究方向：金属制粉研究。E-mail： metallc@sina.com

中图分类号: TB333
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- 被引次数: 0
出版历程
- 收稿日期: 2022-07-04
- 修回日期: 2022-09-29
- 录用日期: 2023-05-31
- 网络出版日期: 2023-12-07
- 刊出日期: 2023-10-20

Influence of hot-pressed sintering temperature on properties of SiCp/Al composites

CAI Jianing^{1, 2},
LE Chen^{2
, ,},
FAN Zimin^1
,,
LI Xin^{1, 2},
TANG Mingqiang²,
ZHAO Fang²

1.
College of Materials Science and Engineering, Xi’an University of Science and Technology, Xi’an 710000, China
2.
TIZ Advanced Alloy Technology Co., Ltd., Quanzhou 362000, Fujian, China

摘要

摘要: 采用热压烧结法制备SiCp/Al复合材料，研究烧结温度对复合材料性能的影响。用X射线衍射、阿基米德排水法、三点弯曲法和扫描电镜分析复合材料样品的物相组成、相对密度、力学性能及微观形貌，并测定其热导率和热膨胀系数。结果表明： SiCp/Al复合材料由SiC、Al和Mg₂Si相组成，加入Mg提高了基体和SiC颗粒之间的浸润性。随着烧结温度升高，复合材料的硬度和抗弯强度先增加后下降，在700 ℃时达到最大值98 HRB和275 MPa；复合材料的热导率先增加后下降，热膨胀系数先下降后增加，在700 ℃时分别达到最大值218.187 W/(m·K)和最小值8.6 × 10⁻⁶ K⁻¹。
- SiCp/Al复合材料 /
- 热压温度 /
- 力学性能 /
- 显微结构 /
- 热学性能
Abstract: SiCp/Al composites were prepared by hot-pressing sintering method, and the effect of sintering temperature on the properties of the composites was studied. The phase compositions, relative density, mechanical properties and micro morphology of the composite samples were analyzed through X-ray diffraction, Archimedes drainage method, the three-point bending method and scanning electron microscope. Additionally, the thermal conductivity and thermal expansion coefficient were measured. The results show that SiCp/Al composites are composed of SiC, Al and Mg₂Si phases. The addition of Mg improves the wettability between the matrix and SiC particles. With the increase of sintering temperature, the hardness and bending strength of the composites first increase and then decrease, reaching the maximum values of 98 HRB and 275 MPa at 700 ℃, respectively. The thermal conductivity of the composites first increases and then decreases, and the thermal expansion coefficient first decreases and then increases, reaching the maximum value of 218.187 W/(m·K) and the minimum value of 8.6 × 10⁻⁶ K⁻¹ at 700 ℃, respectively.
- SiCp/Al composites /
- hot-pressing temperature /
- mechanical properties /
- microstructure /
- thermal properties

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图 1 原料扫描电镜形貌

(a) SiC-1 (b) SiC-2 (c)铝粉 Aluminum powder (d)硅粉 Silicon powder(e)镁铝合金粉末 Magnesium aluminum alloy powder

Figure 1. SEM morphology of raw materials

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图 2 不同温度下烧结样品的 XRD图谱

Figure 2. XRD spectra of sintered samples at different temperatures

下载: 全尺寸图片幻灯片

图 3 不同热压温度下样品的硬度和抗弯强度

Figure 3. Hardness and bending strength of samples at different hot pressing temperatures

下载: 全尺寸图片幻灯片

图 4 不同温度下烧结样品的热导率和热膨胀系数

Figure 4. Thermal conductivity and thermal expansion coefficient of sintered samples at different temperatures

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图 5 不同热压温度下样品的断口形貌：

Figure 5. Fracture morphology of samples at different hot pressing temperatures

(a) 600 ℃ (b) 650 ℃ (c) 700 ℃ (d) 780 ℃ (e) 800 ℃

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表 1 SiC颗粒增强Al的复合材料制备工艺特点

Table 1. Preparation process characteristics of SiC particle reinforced Al composites

制备方法	工艺特点	优点	缺点
粉末冶金法	工艺设备成熟，但结构复杂	成分自由度宽，制得的材料性能及稳定性较好	烧结不易控制，成本高
搅拌铸造法	工艺设备简单，成本低廉	可进行批量化工业生产	材料中的缺陷难以解决，制品体积分数较低
压力铸造法	工艺成熟，成本低	生产周期短，可批量生产	工艺难度大
喷射共沉积法	对设备要求低	工序简单，流程缩短，效率提高，一次成形，适用面广	成本昂贵，过程难控制
无压自浸渗法	工艺相对简单	不用考虑系统压力，成本低，可达到净成形	基体与增强相的润湿性较差
热等静压法	工艺相对简单	力学性能好，实用范围广，材料利用率高	封装技术难以掌控

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表 2 SiCp/Al复合材料的热性能

Table 2. Thermal properties of SiCp/Al composites

名称	烧结温度 θ₁ ℃	导热率 $ \lambda $ W/(m·K)	热膨胀系数 l K⁻¹	参考文献
60vol%SiCp/Al	600	165	5.00 × 10⁻⁶	[17]
50vol%SiCp/6061Al	680	153	8.10 × 10⁻⁶	[18]
60vol%SiCp/Al-5Si-2.5Mg	510	214	9.80 × 10⁻⁶	[19]
(50～70)vol%SiCp/Al	1 100	120～177	(6～10) × 10⁻⁶	[20]
55vol%SiCp/Al (CPS)		200	10.56 × 10⁻⁶	[21]
60vol%SiCp/Al (PCC-AFT)		175	8.00 × 10⁻⁶	[21]

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表 3 实验原料及参数

Table 3. Experimental raw material parameters

原料	体积分数 φ %	D₁₀ μm	D₅₀ μm	D₉₀ μm	氧含量 ω_o %	碳含量 ω_c %	硫含量 ω_s %	密度 ρ₁ g/cm³	松装密度 ρ₂ g/cm³	振实密度 ρ₃ g/cm³
SiC-1	32	8.59	14.22	22.86	0.260	10.79	0.005	3.20	1.19	1.40
SiC-2	32	59.31	94.95	148.90	0.310	8.46	0.005	3.20	1.71	1.70
Al粉	14	10.61	17.10	27.49	0.350	0.16	0.005	2.70	1.15	1.50
镁铝合金粉	20	11.98	32.34	70.55	0.009	0.35	0.003	2.20	0.63	1.08
硅粉	2	2.15	12.86	63.64	0.460	0.03	0.003	2.34	0.44	0.90

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表 4 样品相对密度与温度的关系

Table 4. Relationship between relative density and temperature of samples

温度 θ₂ / ℃	理论密度 ρ_理 / （g·cm⁻³）	实测密度 ρ_测 /（g·cm⁻³）	相对密度 ρ_相对 / %
600	2.93	2.77	94.8
650	2.93	2.81	96.2
700	2.93	2.87	98.1
750	2.93	2.86	97.9
800	2.93	2.79	95.5

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