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超声振动辅助磨削弧区的单颗磨粒切厚特征

张坤 殷振 戴晨伟 苗情 程祺辉

张坤, 殷振, 戴晨伟, 苗情, 程祺辉. 超声振动辅助磨削弧区的单颗磨粒切厚特征[J]. 金刚石与磨料磨具工程, 2022, 42(1): 88-96. doi: 10.13394/j.cnki.jgszz.2021.0109
引用本文: 张坤, 殷振, 戴晨伟, 苗情, 程祺辉. 超声振动辅助磨削弧区的单颗磨粒切厚特征[J]. 金刚石与磨料磨具工程, 2022, 42(1): 88-96. doi: 10.13394/j.cnki.jgszz.2021.0109
ZHANG Kun, YIN Zhen, DAI Chenwei, MIAO Qing, CHENG Qihui. Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding[J]. Diamond &Abrasives Engineering, 2022, 42(1): 88-96. doi: 10.13394/j.cnki.jgszz.2021.0109
Citation: ZHANG Kun, YIN Zhen, DAI Chenwei, MIAO Qing, CHENG Qihui. Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding[J]. Diamond &Abrasives Engineering, 2022, 42(1): 88-96. doi: 10.13394/j.cnki.jgszz.2021.0109

超声振动辅助磨削弧区的单颗磨粒切厚特征

doi: 10.13394/j.cnki.jgszz.2021.0109
基金项目: 国家自然科学基金(51905363);江苏省自然科学基金(BK20190940);江苏省高等学校自然科学研究面上项目(19KJB460008);江苏省研究生科研与实践创新计划项目(KYCX21_3009)。
详细信息
    通讯作者:

    戴晨伟,男,1989年生,博士、副教授、硕士研究生导师。主要研究方向:高效精密磨削加工技术。E-mail: cw.dai@usts.edu.cn

  • 中图分类号: TG58

Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding

  • 摘要: 为准确描述超声振动下的单颗磨粒切厚特征,实测多层金属结合剂金刚石砂轮表面的相邻2颗磨粒的周向间距以及磨粒出刃高度;依据超声振动辅助磨削的磨粒运动轨迹方程及相邻磨粒运动轨迹干涉理论,采用等分线法,利用MATLAB软件求解磨粒在完整接触弧区的单颗磨粒切厚值,并分析各主要参数对单颗磨粒切厚特征的影响。结果表明:相邻磨粒间距、相邻磨粒高度差对单颗磨粒切厚的影响均呈线性变化;单颗磨粒切厚随超声振幅的增大而线性增大,且随超声振动频率的增大而阶段性变化;超声振动辅助磨削的单颗磨粒切厚特征受砂轮转速、磨削深度的影响较大,受工件进给速度的影响相对较小。

     

  • 图  1  磨削弧区切屑微观形成过程

    Figure  1.  Chip formation process in grinding arc zone

    图  2  多层金刚石砂轮工作面磨粒参数测量过程及结果

    Figure  2.  Measurement process and results of abrasive parameters of multi-layer diamond grinding wheel working face

    图  3  超声振动辅助磨削的单颗磨粒切厚特征计算方法

    Figure  3.  Calculation method of undeformed chip thickness characteristics in ultrasonic vibration-assisted grinding

    图  4  相邻磨粒间距对单颗磨粒切厚特征的影响

    Figure  4.  Influence of adjacent grain spacing on undeformed chip thickness characteristic

    图  5  相邻磨粒高度差对单颗磨粒切厚特征的影响

    Figure  5.  Influence of the difference of adjacent grain heights on undeformed chip thickness characteristic

    图  6  超声振动方向对单颗磨粒切厚特征的影响

    Figure  6.  Influence of ultrasonic vibration direction on undeformed chip thickness characteristic

    图  7  超声振幅对单颗磨粒切厚特征的影响

    Figure  7.  Influence of ultrasonic vibration amplitude on undeformed chip thickness characteristic

    图  8  超声振动频率对单颗磨粒切厚特征的影响

    Figure  8.  Influence of ultrasonic vibration frequency on undeformed chip thickness characteristic

    图  9  砂轮转速对单颗磨粒切厚特征的影响

    Figure  9.  Effect of wheel rotational speed on undeformed chip thickness characteristic

    图  10  进给速度对单颗磨粒切厚特征的影响

    Figure  10.  Influence of workpiece infeed speed on undeformed chip thickness characteristic

    图  11  磨削深度对单颗磨粒切厚特征的影响

    Figure  11.  Effect of the depth of cut on undeformed chip thickness characteristic

    表  1  加工参数

    Table  1.   Processing parameters

    参数数值
    砂轮基体直径 db / mm20
    工件长度 Lw / mm2
    磨粒间距 Lg / mm0.145~0.908
    磨粒出刃高度 h / µm27~93
    超声振动方向x, y
    超声振幅 A / µm2, 4, 6, 8, 10, 12
    超声振动频率 f / kHz18, 20, 25, 28, 33, 35, 40
    初始相位 φπ/6
    砂轮转速 n / (r∙min−1)6 000,9 000,10 700,12 000,
    15 000,16 800,18 000,21 000
    工件进给速度 vw / (mm∙min−1)50, 100, 150, 200, 250, 300
    磨削深度 ap / µm5, 12, 15, 20, 25, 29, 35
    下载: 导出CSV
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出版历程
  • 录用日期:  2021-09-26
  • 收稿日期:  2021-07-13
  • 修回日期:  2021-09-18
  • 网络出版日期:  2022-03-17

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