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CVD金刚石膜激光平整化效率和粗糙度

李世谕 安康 邵思武 黄亚博 张建军 郑宇亭 陈良贤 魏俊俊 刘金龙 李成明

李世谕, 安康, 邵思武, 黄亚博, 张建军, 郑宇亭, 陈良贤, 魏俊俊, 刘金龙, 李成明. CVD金刚石膜激光平整化效率和粗糙度[J]. 金刚石与磨料磨具工程, 2022, 42(1): 61-68. doi: 10.13394/j.cnki.jgszz.2021.0104
引用本文: 李世谕, 安康, 邵思武, 黄亚博, 张建军, 郑宇亭, 陈良贤, 魏俊俊, 刘金龙, 李成明. CVD金刚石膜激光平整化效率和粗糙度[J]. 金刚石与磨料磨具工程, 2022, 42(1): 61-68. doi: 10.13394/j.cnki.jgszz.2021.0104
LI Shiyu, AN Kang, SHAO Siwu, HUANG Yabo, ZHANG Jianjun, ZHENG Yuting, CHEN Liangxian, WEI Junjun, LIU Jinlong, LI Chengming. Laser planarization efficiency and roughness of CVD diamond film[J]. Diamond &Abrasives Engineering, 2022, 42(1): 61-68. doi: 10.13394/j.cnki.jgszz.2021.0104
Citation: LI Shiyu, AN Kang, SHAO Siwu, HUANG Yabo, ZHANG Jianjun, ZHENG Yuting, CHEN Liangxian, WEI Junjun, LIU Jinlong, LI Chengming. Laser planarization efficiency and roughness of CVD diamond film[J]. Diamond &Abrasives Engineering, 2022, 42(1): 61-68. doi: 10.13394/j.cnki.jgszz.2021.0104

CVD金刚石膜激光平整化效率和粗糙度

doi: 10.13394/j.cnki.jgszz.2021.0104
基金项目: 国家磁约束核聚变能发展研究专项资助(2019YFE03100200);国家自然科学基金(5210020483);中央高校基本科研业务费(FRF-MP-20-48);北京科技大学顺德研究生院博士后科研经费(2020BH015)。
详细信息
    通讯作者:

    安康,男,1989生,博士后。主要研究方向:金刚石装备制造及性能。E-mail: ankang@ustb.edu.cn

    李成明,男,1962年生,教授、博导。主要研究方向:金刚石薄膜和金刚石单晶,功能薄膜材料。E-mail: chengmli@mater.ustb.edu.cn

  • 中图分类号: TQ16

Laser planarization efficiency and roughness of CVD diamond film

  • 摘要: 对化学气相沉积(CVD)多晶金刚石膜进行激光平整化的正交试验,使用场发射环境扫描电子显微镜(SEM)进行形貌分析,激光共聚焦扫描显微镜测量线粗糙度Ra、面粗糙度Sa和切缝锥度,分析激光参数对CVD膜平整化的影响。结果表明:影响切缝锥度的因素依次为脉冲宽度、脉冲频率、进给速度和激光电流,影响线粗糙度Ra的因素依次为进给速度、激光电流、脉冲频率、脉冲宽度。正交试验优化后,当激光电流为64 A、脉冲宽度为400 μs、脉冲频率为275 Hz、进给速度为100 mm/min时,可获得最佳的切槽表面形貌。采用该优化参数进行面扫描,测得面粗糙度Sa为11.7 μm;进一步增加入射角度至75°时,面粗糙度Sa降低至1.9 μm,实际去除效率达到1.1 mm3/min。

     

  • 图  1  激光切口侧视图

    Figure  1.  Laser kerf side view

    图  2  激光切口简化示意图

    Figure  2.  Laser kerf simplified schematic diagram

    图  3  不同脉冲宽度对切缝的形貌影响

    Figure  3.  Influence of different laser pulse width on the morphology of the kerf

    图  4  切缝锥度和线粗糙度Ra随脉冲宽度变化曲线

    Figure  4.  Curves of taper and roughness Ra changing with pulse width

    图  5  切缝锥度和线粗糙度Ra随激光电流变化曲线

    Figure  5.  Curves of taper and roughness Ra changing with current

    图  6  切缝锥度和线粗糙度Ra随频率变化曲线影响

    Figure  6.  Curves of taper and roughness Ra changing with frequency

    图  7  切缝锥度和线粗糙度Ra随进给速度变化曲线

    Figure  7.  Curves of taper and roughness Ra changing with feed speed

    图  8  面粗糙度Sa和烧蚀深度随切缝步长变化曲线

    Figure  8.  Variations of surface roughness Sa and ablation depth with step size

    图  9  入射角对表面形貌的影响

    Figure  9.  Influence of incident angle on surface topography

    图  10  面粗糙度Sa和烧蚀深度随入射角α变化曲线

    Figure  10.  Curves of surface roughness Sa and ablation depth changing with incident angle

    图  11  激光平整金刚石膜表面原理图

    Figure  11.  Schematic diagram of laser flattening diamond film surface

    图  12  3组试验的材料去除效率和面粗糙度Sa变化

    Figure  12.  Changes of material removal efficiency and surface roughness Sa in three groups of experiments

    表  1  正交试验工艺参数

    Table  1.   Orthogonal test process parameters

    水平A
    电流 I / A
    B
    脉宽 t / μs
    C
    频率 f / Hz
    D
    进给速度 v / (mm·min−1)
    160400200100
    262425225200
    364450250300
    466475275400
    568500300500
    下载: 导出CSV

    表  2  机械研磨和激光平整化对比参数

    Table  2.   Comparative parameters of mechanical grinding and laser planarization

    试验序号粒度代号进给速度 v / (mm·min−1)
    180/100100
    2200/230200
    3M36/54300
    下载: 导出CSV
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出版历程
  • 录用日期:  2021-10-13
  • 收稿日期:  2021-07-14
  • 修回日期:  2021-08-26
  • 网络出版日期:  2022-03-17

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