3D simulation study on the chip formation process in high speed and ultra-high speed grinding of nickel-based superalloy
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摘要: 建立单颗磨粒磨削GH4169镍基高温合金的三维有限元仿真模型,研究高速、超高速磨削条件下的磨屑形貌演化过程及磨削力变化规律,观察磨削区域内的应力应变、温度等物理参量的分布和变化,分析磨削速度和单颗磨粒切厚对磨屑形貌、成屑频率及沟槽隆起特征的影响。结果表明:高速、超高速磨削镍基高温合金时,易出现锯齿形磨屑;磨削力呈周期性变化,其周期与磨屑形成过程对应;磨削过程中的温度、应变以及应变率主要集中在剪切带区域,而应力则集中在剪切带的两侧。随磨削速度增大,磨屑锯齿间间距变小,锯齿化程度增强,成屑频率呈线性增大趋势,沟痕隆起比升高。此外,单颗磨粒磨削GH4169的临界成屑切厚约为0.3 μm,当切厚为0.8 μm时有锯齿形磨屑出现,且随单颗磨粒切厚增大,锯齿化程度增强,但成屑频率降低。
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关键词:
- 单颗磨粒 /
- GH4169镍基高温合金 /
- 高速磨削 /
- 有限元仿真
Abstract: A three-dimensional finite element simulation model about high speed and ultra-high speed grinding of GH4169 nickel-based superalloy with a single abrasive was established. The evolution process of chip morphology and the change rule of grinding forces under high speed and ultra-high speed grinding conditions were studied. The distribution and change of physical parameters such as stress, strain and temperature in the grinding area were observed. The influences of the grinding speed and the cutting thickness of single abrasive on the chip morphology, the chip forming frequency and the groove uplift characteristics were analyzed. The results show that the sawtooth chip is easy to appear when grinding high temperature nickel-based alloy at high speed. The grinding force changes periodically, and its period corresponds to the formation process of the chip. The temperature, the strain and the strain rate in the grinding process are mainly concentrated in the shear zone, while the stress is concentrated on two sides of the shear zone. With the increase of grinding speed, the spacing between the sawtooth decreases, the degree of serration increases, the sawtooth forming frequency increases linearly, and the groove uplift ratio increases. In addition, the critical forming chip cutting thickness of GH4169 is about 0.3 μm. When the cutting thickness is 0.8 μm, the sawtooth chip will appear. With the increase of single abrasive cutting thickness, the degree of serration will increase, but the chip forming frequency will decrease.
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